In order to explore the effect of microstructure and crystal organization of copper （Cu） foil on the performance of exploding foil initiator（EFI）， three Cu foils with different crystal morphologies were prepared through the closed-field non-equilibrium magnetron sputtering ion plating technique and Lift-Off etching method under the sputtering power of 150， 450 W and 800 W. Experimental characterizations of the electrical explosion performance and flyer velocity of exploding foil （EF）， and the ignition performance of EFI were conducted subsequently. Average grain size of the samples fabricated at 150， 450 W and 800 W are 19.6-36.7nm， 41.5-62.9 nm and 58.6-80.2 nm， surface average roughness are in turn 6.7， 16.9 nm and 46.2 nm， and the adhesion force are 42.436， 55.569 mN， and 71.135 mN， respectively. Of which， the Cu foil prepared at 800 W exhibits the largest and the most uniform grain size， the densest and smoothest grain， the fewest grain boundaries， the largest surface roughness and the strongest adhesion force. The corresponding EF has the smallest resistance and inductance， highest energy conversion efficiency and flyer velocity. The 50% firing sensitivity of the integrating EFI sputtered at 800 W are 19.1% and 22.6% higher than the samples sputtered at 450 W and 150 W， respectively.