Each technology upgrading of Exploding Foil Initiator system (EFIs) is accompanied with the innovation of design concepts and manufacture processes, especially the technologies of Micro Electro Mechanical System (MEMS) and Low Temperature Co-fired Ceramics (LTCC) greatly promote the development of Micro Chip Exploding Foil Initiator system (McEFIs). The advantages and disadvantages of Micro Chip Exploding Foil Iinitiator (McEFI) fabricated by two kinds of processes were briefly analyzed. The working performances of several planar high-voltage switches in Capacitor Ddischarge Unit (CDU) were listed, and the feasibility of manufacture idea and research method of the switch is obtained. The research progress at home and abroad based on the preparation of MEMS process and LTCC process, and the study of McEFI, planar high-voltage switch as well as planar high-voltage switch integrated with McEFI was summarized respectively. Key research directions were put forward. In-depth research of the fabrication of McEFI and its planar high-voltage switch by the MEMS process will achieve engineering application. The planar high-voltage switch & McEFI with monolithic structure can be fabricated by LTCC technology.